MEMpax®

A unique range of exceptional properties make MEMpax® a go-to product for a broad range of applications. Durability in processing, suitability for high-temperature bonding, a wide array of sizes, and its availability in unrivalled low thickness ranges make MEMpax® truly stand out.

High durability in extremely low thicknesses

Outstanding chemical resistance

As with SCHOTT's groundbreaking BOROFLOAT®, MEMpax® offers the highest chemical durability, enabling it to withstand the most aggressive conditions during processing and application. Due to its glass composition, MEMpax® is also a high-quality electrical insulator.

Built for bonding

MEMpax® has a coefficient of thermal expansion (CTE) that matches a silicon wafer, enabling very low stresses in the anodic bonding of glass to silicon wafers. Extremely low roughness of its surface (typically Ra ≤ 0.5 nm) further facilitates this process.

Wavelengths you can work with

Similar to BOROFLOAT®, MEMpax® exhibits high transmission in the visible wavelength range, including deep into the UV-range. This makes the material highly suitable for UV debonding in semiconductor processes.

Shapes, sizes and thicknesses to suit

SCHOTT prides itself on working with customers to meet their needs as specifically as possible, and our glass wafers are no exception. Available in custom shapes, as well as standard round varieties, the spectrum of sizes ranges from 2-12", with thicknesses from 0.07-0.55 mm.